Laurence
031074c9a9
Bootstrap of the project (M0). Sets up the monorepo, design docs, hardware BOM, the open API contract, component skeletons, licensing and CI, following the Default Workflow SOP. What changed: - CLAUDE.md + docs/: copied the Default Workflow so sessions load the SOP. - state/: PROJECT, ARCHITECTURE, DECISIONS, TODO, NOTES filled in for OpenScribe. ARCHITECTURE captures the four-part design (firmware, server, app, case) and the three sync paths; DECISIONS records the hardware, AI-stack, storage, app and licensing choices; TODO lays out milestones M1-M9. - hardware/BOM.md: two build options (compact XIAO ESP32-S3 Sense; dev ESP32-S3 + I2S mic + SD), wiring/pinout, indicative cost. - api/openapi.yaml: the completely open API (device + server surfaces), including recording list/download/delete and exports (wav/ogg/txt/srt/vtt/md/json). - firmware/: PlatformIO ESP32-S3 project, two board profiles, pin map, boot scaffold with module seams for M1-M4. - server/: FastAPI skeleton mirroring the OpenAPI, config for self-hosted MinIO, faster-whisper and Ollama; stub routes browsable at /docs. - app/, case/: Flutter app plan; parametric OpenSCAD enclosure. - Licensing: GPL-3.0 (code), CERN-OHL-S-2.0 (hardware), CC-BY-SA-4.0 (case/docs), REUSE-style LICENSES/ with SPDX headers; LICENSING.md explains the split. - CI: Forgejo Actions workflow builds firmware (both profiles) and lints/imports server. Why: - Everything self-hosted and openly licensed per the user's requirements: an open API, three sync paths (BLE control, WiFi transfer, independent WiFi upload on charge to generic cloud storage), and a full self-hosted transcription+summary stack. Notes: - No custom PCB in v1; off-the-shelf modules. Physical verification waits on parts. - Component code is stubs at M0; features land milestone by milestone, each as its own branch/PR per the workflow. Co-Authored-By: Claude Opus 4.8 <noreply@anthropic.com>
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936 B
Markdown
24 lines
No EOL
936 B
Markdown
# OpenScribe case
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Parametric 3D-printed enclosure, in OpenSCAD.
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> Status: M0 scaffold. `openscribe_case.scad` is a parametric two-part shell with the
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> openings a recorder needs (mic port, button, USB, LED). M8 measures the chosen build,
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> tunes the parameters, adds a clip/lanyard mount and print tolerances, and exports STLs.
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## Render / export
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- Open `openscribe_case.scad` in OpenSCAD.
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- Set `part` to `bottom`, `top` or `both`, then F5 (preview) / F6 (render).
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- Export STL (or use the CLI): `openscad -o case_top.stl -D 'part="top"' openscribe_case.scad`
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## Parameters
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Board and battery dimensions default to Build A (XIAO ESP32-S3 Sense + a small LiPo). Edit
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the `[Board]` / `[Battery]` / `[Enclosure]` / `[Openings]` variables at the top to fit your
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build from `../hardware/BOM.md`.
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## Printing
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- Material: PLA or PETG. 0.2 mm layers, 3 perimeters.
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- STL/3MF/gcode exports are gitignored; commit only the `.scad` source. |